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●Low vSwR
●Low Insertion Loss
●Multiple launch configurations to optimize match to circuit
●Optimum performance when board launch geometry isgrounded coplanar (CPWG) or top ground microstrip
●Unique clamping mechanism accommodates a widerange of board thicknesses (up to . 110") while providinga continuous ground connection between end launch andcircuit board
●Launch overhang that allows ground to be picked upclose to the launch point
●Universal, robust & reusableNo soldering required
●Connectors ship fully assembled (board not included)
Datasheet
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